ELECTRONIC ASSEMBLY

CABLE & MECHANICAL ASSEMBLY

ACT utilizes all leading manufacturing technologies, including BGA (ceramic, micro, and column grid), wire bonding, laser optimization and RF. Our solutions range from surface mount and mixed technology PCAs to subassemblies and complex system level products.

ACT solutions include industry standard and leading edge interconnect technologies, including flat IDC, multi-conductor (including SCSI and .8mm), RF, VHDCI, ribbon, fibre channel, and co-ax cables; discrete harnesses; as well as molded and mechanical assemblies.

Advanced Engineering

Mixed Technology

Advanced Packages

Fibre Channel

Mechanical Assembly

Mechanical Assembly

Electro-
mechanical Assembly

Complete System Integration

Radio Frequency (RF)

Molded Cable

Shielded Flat Cable

Ribbon Cables

Automated Inspection

Automated Inspection

Test Capabilities

Shielded
Molded Cables

Multi-Conductor Cables